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Sourcing News
- Funding opportunity for advanced packaging technologies 24th April 2024In this article, IPC’s senior director of North American relations, Richard Cappetto, highlights new funding streams for advanced packaging materials and substrates. IPC praised issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities to establish and accelerate domestic […]
- Bringing semiconductor manufacturing back to the UK 24th April 2024In this article, CIL’s managing director, John Boston, explains how advanced technology is being used to return semiconductor manufacturing to the UK. European OEMs are accustomed to importing semiconductor products, subassemblies and components from Far Eastern suppliers due to their lower staffing andmanufacturing costs. However, problems and threats in Eastern Europe, the Middle East, Red […]
- Choosing a custom IC partner 24th April 2024Swindon Silicon Systems’ director of business development and product engineering, Ross Turnbull, explains what to consider before embarking on an ASIC design project. For manufacturers looking to gain a technical and commercial edge over their competition, an application specific IC (ASIC) could be the ideal solution. An ASIC is a chip designed specifically for its designated […]